Intel CEO: 18A chip design to begin test production phase next year - Nikkei Asia

Investing.com -- Intel's most advanced chip design is set to move into the test production phase by the first quarter of next year, according to comments Tuesday from the semiconductor group's chief executive that were quoted by Nikkei Asia.

The news outlet reported that Intel (NASDAQ:INTC) CEO Pat Gelsinger told a conference in Taiwan that the device, known as the 18A, now has "many test wafers coming out at this moment." He also claimed the "invention phase of the 18A is [...] complete," adding that the U.S. company is "racing to production," Nikkei Asia said.

Along with its own products, Intel has announced that the 18A manufacturing technology will also be used in chips for outside customers like telecommunications gear maker Ericsson (BS:ERICAs).

The California-based company has said that it is aiming to have the 18A manufacturing process ready by 2025, a timeline that roughly coincides with production plans from rivals Samsung (KS:005930) and Taiwan Semiconductor Manufacturing Co. for similar advanced chips.

Establishing a presence in advanced chip manufacturing is key for Intel, particularly as it looks to reassure investors that its crucial PC and server businesses will remain dominant despite intensifying competition brought on by the growing popularity of artificial intelligence.